Chuyên viên công nghệ hàn Reflow/ Reflow Specialist

Vapor Phase Reflow Process

-          Develop, optimize, qualify, and maintain VPR recipes for ATE products.

-          Define and control the process window based on PCB, Components, Substrate design, solder alloy, component limitations, fixture, and product requirements.

-          Evaluate the thermal behavior and cumulative thermal exposure of the complete assembly.

-          Establish and maintain Golden Recipe / Master Recipe and ensure correct product-to-recipe matching.

-          Lead requalification after significant material, equipment, fixture, design, or process changes.

-          Identify components at risk of drop, shift, rotation, solder-joint disturbance, or thermal damage during reflow.

Process Qualification & Troubleshooting

-          Develop VPR qualification plans and acceptance criteria for new products and process changes.

-          Lead troubleshooting and root-cause analysis for defects related to reflow process such as: Component drop/shift, Substrate movement or misalignment, Open/short, bridging, non-wetting, PCB/substrate warpage or delamination, thermal damage.

-          Apply structured problem-solving methods such as 5 Why, Fishbone, DOE, Pareto, SPC, and 8D where appropriate

Process Control & Continuous Improvement

-          Monitor process performance, defect trends, and First Pass Yield.

-          Maintain SOP, WI, recipe, qualification records, PFMEA/Control Plan inputs, and change-control documentation.

-          Train Engineers, Technicians, and Operators on VPR process, recipe control, fixture setup, component protection, and troubleshooting.

-          Bachelor's degree in Materials, Mechanical, Electrical/Electronics, Manufacturing, Chemical Engineering, or related technical field.

-          Preferred 3+ years of experience in Reflow, SMT, PCBA, or thermal process engineering.

-          Solder paste/alloy and solder-joint behavior during repeated thermal cycles.

-          Hands-on experience with Vapor Phase Reflow is strongly preferred.

-          Experience with large PCB, thick/multilayer PCB, high thermal mass assemblies, or high-mix low-volume manufacturing is preferred.

-          Experience with ATE, semiconductor equipment, or advanced electronic assembly is an advantage.

-          Ability to work effectively in a fast-paced, cross-functional environment.