21/06/2024
Mechanical / Auto / Automotive , Chemical Eng. , Electrical / Electronics
Permanent
16 Mil - 35 Mil VND
Experienced (Non - Manager)
21/07/2024
- New Product Introduction (NPI) of System in Package (SiP) products
- Design review for manufacturing (DFM), technical risk assessment (TRA) and assembly process flow suggestion for new products from customers
- Development of new technologies required for NPI – including process, material, system
- Trouble shooting for technical or quality problems during NPI procedure
- Direct collaborations and frequent communications with customer counterparts
- Close collaboration with factory teams for seamless transition from NPI to mass production
- Master's degree in material, mechanical, chemical, electrical engineering or equivalent if Fresher candidate.
- Bachelor's degree in material, mechanical, chemical, electrical engineering or equivalent and having at least 1-2 years as R&D Engineer for Semiconductor package product or assembly process for System in Package (SiP)
- English skill: At least Intermediate level
- No barrier to working abroad for a short time in South Korea or the other company World Wide sites
- Intermediate or higher level of utilization ability for AutoCAD
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