Assembly Process Engineer

Job Description

Key Responsibilities:

Customer Engagement & Support

• Serve as the main technical liaison for all assembly-related activities at the customer site.

• Understand and translate customer requirements into internal actions; support new product introduction (NPI), mass production ramp, and sustaining activities.

• Communicate effectively and regularly with customer stakeholders, providing updates on assembly progress, issues, and resolutions.

• Drive customer satisfaction through responsiveness, proactive problem-solving, and on-site support.

OSAT Oversight & Management

• Oversee daily OSAT operations (Assembly line activities, equipment performance, yields, process metrics).

• Provide technical guidance and support for assembly process development and troubleshooting at OSATs.

• Ensure OSATs adhere to internal manufacturing standards, procedures, and customer-specific quality and process specifications.

• Review and approve process flows, work instructions, and control plans.

• Lead or support qualification activities (materials, equipment, and process changes).

Yield, Quality, and Process Improvement

• Monitor and analyze key process indicators such as yield, cycle time, and defect density.

• Investigate and resolve process-related issues, implementing root cause analysis (8D, DMAIC, etc.).

• Drive continuous improvement initiatives to optimize assembly processes and reduce cost of poor quality.

• Collaborate with Failure Analysis, Quality, and Engineering teams for rapid issue resolution.

Documentation & Reporting

• Maintain detailed documentation of engineering activities, changes, and risk assessments.

• Generate and present periodic reports (weekly, monthly) summarizing OSAT performance, key projects, and customer feedback.

• Track process change notifications (PCNs) and engineering change orders (ECOs) related to assembly.

Job Requirement

Requirements:

Education & Experience

• Bachelor's degree or higher in Materials Science, Mechanical Engineering, Electronics Engineering, or a related field.

• 3 years of hands-on experience in semiconductor assembly and packaging processes.

• Experience working with or managing OSATs is highly preferred.

Technical Skills

• Strong knowledge of semiconductor assembly processes: die attach, wire bonding, molding, singulation, etc.

• Understanding of process control methodologies (FMEA, SPC, DOE, 8D, etc.).

• Familiar with manufacturing standards (JEDEC, IPC, etc.) and quality systems (ISO, IATF).

• Proficiency in data analysis and reporting tools (JMP, Minitab, Excel, etc.).

Soft Skills

• Excellent communication and interpersonal skills, especially in customer-facing environments.

• Ability to work independently and handle high-pressure situations.

• Strong project management and time management capabilities.