DEVICE ANALYSIS ENGINEER (MATERIAL &PHYSICAL)

Job Description

Core Responsibilities

We are looking for a passionate, high initiative and hardware talent to join us in below areas:

* This role will be performed in a variety of activities, ranging from DAE lab management, strategy development to hands-on Materials and Physical Failure Analysis. This will provide the best performance/cost options for Microsoft and its hardware products and provide actionable information that drives change and improves quality and reliability.

* Develop and implement a Materials and Physical Failure Analysis operating model leveraging internal and external labs to build critical internal FA functions/labs; manage a global network of external Materials and Physical Analysis providers.

· Hands-on conduct comprehensive materials, and physical analysis for both new product introductions and sustaining product improvements, ensuring prompt fault isolation and identification of failure mechanisms.

· Develop effective containment plans based on recognized failure mechanism with other functional teams together.

· Relentless drive root cause analysis and corrective actions for critical issues.

· Determine liability on critical and challenging issues by engaging with component suppliers to perform FA at the supplier level.

· Prepare Lesson Learnt / Feed Forward for continuous improvement on device quality for new generation products.

Job Requirement

Qualifications:

·         Minimum Bachelor’s degree in Materials Science, or Physics, or Chemical Engineering with 5 years related work experience or Master’s degree with 3 years related work experience,

·         Demonstrate strong technical knowledge in electronic product structure, manufacturing process, and metrology.

·         Deep understanding with hands-on experience on common material analysis and failure analysis tools such as X-Ray, 3D Microscope, SEM, EDX, FIB, FTIR, TGA, DSC. Well know about the sample prep process such as Cross-section, Ion Milling, Dye and Pry.

·         Quick learner of Microsoft systems and able to work independently with minimum direct supervision.

·         Excellent logical thinking, problem analyzing & solving skills, and strong ability to drive for problem closure.  

·         Demonstrated passion for finding the root cause and sense of urgency.

·         Good interpersonal skill and effective communication which able to express technical concepts in verbal and written English with cross functional teams.

Preferred Qualifications: 

·         Rich work experience on electrical product design or manufacturing.

·         Experience on AI application on materials and failure analysis work.

·         Deep understanding of advanced material analysis and chemical analysis tools such as TEM, XPS, Auger, TOF SIMS, GCMS, Nano Indentation etc. and transfer those FA data into action.

·         Knowledge of electronic systems, with experience in material microstructure analysis, or metallography, or Polymer materials analysis, or surface treatment process and techniques.

Experience in material and failure analysis on Display Research, Development, or Process. OLED, mini LED related